CFP - 1997 Intl. Symp. on Physical Design, April 14-16 
Author Message
 CFP - 1997 Intl. Symp. on Physical Design, April 14-16

                             Call for Papers

               1997 International Symposium on Physical Design
                             April 14-16, 1997
                          Napa Valley, California

              Sponsored by the ACM SIGDA in cooperation with
                   IEEE Circuits and Systems Society

The International Symposium on Physical Design provides a forum to exchange
ideas and promote research on critical areas related to the physical design
of VLSI systems.     All aspects of physical design, from interactions with
behavior- and logic-level synthesis, to back-end performance analysis and
verification, are within the scope of the Symposium.    Target domains include
semi-custom and full-custom IC, MCM and FPGA based systems.

The Symposium is an outgrowth of the ACM/SIGDA Physical Design Workshop.  
Following its five predecessors, the symposium will highlight key new
directions and leading-edge theoretical and experimental contributions to
the field. Accepted papers will be published by ACM Press in the Symposium
proceedings. Topics of interest include but are not limited to:

       1. Management of design data and constraints
       2. Interactions with behavior-level synthesis flows
       3. Interactions with logic-level (re-)synthesis flows
       4. Analysis and management of power dissipation
       5. Techniques for high-performance design
       6. Floorplanning and building-block assembly
       7. Estimation and point-tool modeling
       8. Partitioning, placement and routing
       9. Special structures for clock, power, or test
      10. Compaction and layout verification
      11. Performance analysis and physical verification
      12. Physical design for manufacturability and yield
      13. Mixed-signal and system-level issues.

IMPORTANT DATES:    Submission deadline:              December 20, 1996
                    Acceptance notification:          February 1, 1997
                    Camera-ready (6 page limit) due:  March 1, 1997

SUBMISSION OF PAPERS:
    Authors should submit full-length, original, unpublished papers
    (maximum 20 pages double spaced) along with an abstract of at most
    200 words and contact author information (name, street/mailing address,
    telephone/fax, e-mail).

    Electronic submission via uuencoded e-mail is encouraged (single
    postscript file, formatted for 8 1/2" x 11" paper, compressed with
    Unix "compress" or "gzip''). Email to:


    Alternatively, send ten (10) copies of the paper to:

                        Prof. Majid Sarrafzadeh
                        Technical Program Chair, ISPD-97
                        Dept. of ECE, Northwestern University
                        2145 Sheridan Road, Evanston, IL 60208 USA
                        Tel 847-491-7378 / Fax 847-467-4144

SYMPOSIUM INFORMATION:
    To obtain information regarding the Symposium or to be added to the

    Information can also be found on the ISPD-97 web page:  

                          http://www.*-*-*.com/ .{*filter*}ia.edu/~ispd97/

SYMPOSIUM ORGANIZATION:

Steering Committee:          J. Cohoon ({*filter*}ia), S. Dasgupta (Sematech),
                             S. M. Kang (Illinois), B. Preas (Xerox PARC)
Past Chair:                  G. Robins ({*filter*}ia)
General Chair:               A. B. Kahng (UCLA and Cadence)
Program Chair:               M. Sarrafzadeh (Northwestern)
Keynote Address:             T. C. Hu (UC San Diego) and E. S. Kuh (UC Berkeley)
Special Address:             R. Camposano (Synopsys)
Publicity Chair:             M. J. Alexander (Washington State)
Local Arrangements Chair:    J. Lillis (UC Berkeley)
Technical Program Committee: C. K. Cheng (UC San Diego),
                             W. W.-M. Dai (UC Santa Cruz),
                             J. Frankle (Xilinx),
                             D. D. Hill (Synopsys),
                             M. A. B. Jackson (Motorola),
                             J. A. G. Jess (Eindhoven),  
                             Y.-L. Lin (Tsing Hua),
                             C. L. Liu (Illinois),
                             M. Marek-Sadowska (UC Santa Barbara),
                             M. Sarrafzadeh (Northwestern), Chair,
                             C. Sechen (Washington),
                             K. Takamizawa (NEC),
                             M. Wiesel (Intel),
                             D. F. Wong (Texas-Austin),
                             E. Yoffa (IBM)



Wed, 17 Mar 1999 03:00:00 GMT  
 
 [ 1 post ] 

 Relevant Pages 

1. CFP: 1997 Intl. Symp. on Physical Design, April 14-16, CA

2. CFP: 1997 Intl. Symp. on Physical Design, April 14-16, CA

3. CFP: 1997 Intl. Symp. on Physical Design, April 14-16, CA

4. CFP: 1997 Intl. Symp. on Physical Design, April 14-16, CA

5. CFP - 1997 Intl. Symp. on Physical Design, April 14-16

6. CFP: 1997 Intl. Symp. on Physical Design, April 14-16, CA

7. CFP: 1997 Intl. Symp. on Physical Design, April 14-16, CA

8. CFP: 1997 Intl. Symp. on Physical Design, April 14-16, CA

9. CFP: 1997 Intl. Symp. on Physical Design, April 14-16, CA

10. CFP: 1997 Intl. Symp. on Physical Design, April 14-16, CA

11. CFP: 1997 Intl. Symp. on Physical Design, April 14-16, CA

12. CFP: 1997 Intl. Symp. on Physical Design, April 14-16, CA

 

 
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